Welcome to EEI 2023

8th International Conference on Emerging Trends in Electrical, Electronics & Instrumentation Engineering (EEI 2023)

March 11-12, 2023, Virtual Conference

Program Committee

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Accepted Papers

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Virtual Conference




Scope Call for Participation Program Schedule

8th International Conference on Emerging Trends in Electrical, Electronics & Instrumentation Engineering (EEI 2023) aims to bring together researchers and practitioners from academia and industry to focus on recent systems and techniques in the broad field of electrical, instrumentation and communication Engineering.


Registered authors are now able to present their work through our online platforms

Call for Papers


8th International Conference on Emerging Trends in Electrical, Electronics & Instrumentation Engineering (EEI 2023) aims to bring together researchers and practitioners from academia and industry to focus on recent systems and techniques in the broad field of electrical, instrumentation and communication Engineering. Original research papers, state-of-the-art reviews are invited for publication in all areas of Electrical Electronics & Instrumentation Engineering.


Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to:

Topics of interest include, but are not limited to, the following


  • Semiconductor Devices
  • Non Conventional Energy Resources
  • Analog and Digital Circuit Design
  • RF and Microwave Engineering
  • Optical Networks & Communication
  • Information Systems and Network Security
  • Remote Sensing and Satellite Communication
  • Bio Informatics
  • Advanced Power System & Control System
  • Sensor Technology & Virtual Instrumentation
  • VLSI Technology & Design
  • Digital Signal Processing
  • Biomedical Instrumentation
  • Embedded Systems and Robotics
  • Power Electronics & Electric Drives
  • System Modeling & Simulation
  • Mechatronics & Avionics
  • Optimization Techniques
  • Soft Computing / Nano computing/ Grid computing

Paper Submission

Authors are invited to submit papers through the conference Submission System by Closed. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Electrical and Electronics Engineering: An International Journal (ELELIJ) (Confirmed).

Important Dates

Third Batch : (Submissions after February 12, 2023)

Submission Deadline
Closed

Authors Notification
March 09, 2023

Registration & camera - Ready Paper Due
March 10, 2023

Proceedings

The soft copy of the proceedings will be available on Journal web pages.

The Registration fee is 250 USD for accepted article Authors. Atleast one author of accepted paper is required to register at the full registration rate.

Speakers


David Noever
PeopleTec
USA

Danqin Wu
Beijing University of Posts and Telecommunications
China

Simisani Ndaba
University of Botswana
Botswana

Muhammad Danial Khilji
United Kingdom

Asma BelHadjBraiek
Carthage University
Tunisia

Ruoqi Pan
Nanning University
China

Ke Huang
Nanning University
China

Arvind Chandrasekaran
Colorado Technical University
USA

Liwayway Acero
San Beda University
Philippines

Radhouane Boughammoura
University of Monastir
Tunisia

Lucy Mackintosh
University of Hertfordshire
United Kingdom

Yaoyu Zhang
Xiamen University
China

Hafsa GulzarDonghua
University Shanghai
China

Sajad Meisami
Illinois Institue of Technology
USA

Hasibul Alam
The University of Texas Rio Grande Valley
USA

Botir Usmonov
Tashkent Institute of Chemical Technology
Uzbekistan

Coffi Martinien Zounhin Toboula
University of Abomey Calavi (UAC)
Benin

Dekande Sylvestre Tchagnonhou
Djibo Hamani University of Tahoua
Benin

Abdourahmane SENGHOR
Cheikh Anta Diop University Of Dakar
Senegal

Shasha Luo
Rajamangal University of Technology Thanyaburi
Thailand

Yanrong Li
University of Posts and Telecommunications
China

Samin Poudel
North Carolina Agricultural and Technical State University
USA

Vinyasi
USA

Sponsors